发明名称 |
Substrate with built-in component, and method for producing said substrate |
摘要 |
A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced. |
申请公布号 |
GB201305307(D0) |
申请公布日期 |
2013.05.08 |
申请号 |
GB20130005307 |
申请日期 |
2011.10.07 |
申请人 |
MURATA MANUFACTURING CO., LTD |
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