| 摘要 |
PURPOSE: A thermosetting resin composition is provided to obtain a cured material with low bowing property and excellent cooling and heating cycle and to minimize formation of crack in a state of stage B. CONSTITUTION: A thermosetting resin composition comprises an epoxy resin, a curing agent for an epoxy resin, a spherical silicon dioxide and/or spherical aluminum oxide, and a block copolymer. The weight average molecular weight(Mw) of the block copolymer is 50,000-300,000 and the molecular weight distribution(Mw/Mn) is 3 or less. The amount of the spherical aluminum oxide is 50 weight% or more, based on the total thermosetting resin composition. A thermal curable film is obtained by spreading the thermosetting resin composition on a film and drying the spread material. [Reference numerals] (AA) Example of X; (BB) Example of Δ; (CC) Example of O |
