发明名称 Process for the fabrication of a hole
摘要 The method comprises providing a layer system having a metallic substrate (4) and an outermost ceramic layer, and providing a pulsed energy beam with a shorter pulse length and a longer pulse length (greater than 0.4 ms) in different ablation steps, where: the energy beam is a laser beam; and other pulse lengths are used during first ablation steps than in one of last ablation steps. The shorter longer pulse lengths are used during first ablation steps than in one of last ablation steps. The energy beam is displaced over a surface of a component. The method comprises providing a layer system having a metallic substrate (4) and an outermost ceramic layer, and providing a pulsed energy beam with a shorter pulse length and a longer pulse length (greater than 0.4 ms) in different ablation steps, where: the energy beam is a laser beam; and other pulse lengths are used during first ablation steps than in one of last ablation steps. The shorter longer pulse lengths are used during first ablation steps than in one of last ablation steps. The energy beam is displaced over a surface of a component during the ablation steps with shorter pulse lengths to ablate material in a region of a plane of a hole to be produced. The longer pulse length is used to ablate a metallic interlayer or the metallic substrate. The energy beam is displaced over the surface of the component during longer pulse durations. The pulse length is varied continuously or discontinuously during the production of the hole. The laser having a different wavelength of 532 nm or 1064 nm is used. The lasers are used to produce the hole. The shorter pulse lengths of = 100 ns are used during last ablation steps or during the first ablation steps. An outer upper region of the hole is initially produced with shorter pulse lengths and then a lower region (10) of the hole is produced with longer pulse lengths. An outer edge region is initially produced with shorter pulse lengths and then an inner region of the hole is produced with longer pulse lengths. A pulse duration of greater than 0.4-1.2 ms is used for the longer pulses. The longer pulses have energy of 8 joules, and a power of 10-20 kW. The energy of the shorter pulses lies in or below a two-figure millijoule range. The shorter pulses have a power in kilowatt range. The longer pulses generate a cross-sectional area of the region to be ablated on the component corresponding to the cross-sectional area of the hole to be produced. An output power (less than 500 watts) of the laser is used for the longer pulses. An output power (less than 300 watts) of the laser is used for the shorter pulses.
申请公布号 EP2589457(A1) 申请公布日期 2013.05.08
申请号 EP20130000477 申请日期 2007.01.05
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BECK, THOMAS;SETTEGAST, SILKE
分类号 B23K26/38;B23K26/06 主分类号 B23K26/38
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