| 摘要 |
PURPOSE: A high density asymmetry multilayer substrate having an odd number pattern layer of a simple asymmetric structure, an RF module, and an asymmetry multilayer substrate manufacturing method are provided to enable a low cost design and manufacturing by improving the impedance transformation of the inter-layer interconnection. CONSTITUTION: An asymmetry multilayer substrate is comprised of the followings: a core layer(20) which penetrates and connects the upper and lower part and forms a through-hole; a first pattern layer(10) which is formed on the upper part or lower part of the core layer, and includes a first signal line pattern which is connected to the through-hole; a second pattern layer(30) which is formed in the other upper or lower part of the core layer, and includes a second metal plate which provides the capacitance between a second path pattern connected to the through-hole and a pattern of an adjacent outline pattern layer; a first insulation layer(40) which is formed in a thickness less than the thickness of the core layer on a second pattern layer, and forms a first VIA which is connected to the second path pattern; and a third pattern layer(50) which is formed on the first insulation layer, and includes a third signal line pattern which is connected to the first VIA. An impedance conversion circuit is formed which includes an impedance loading on a transmission line or a parasitic capacitance load on the transmission line for the impedance matching in the signal transmission between the signal line patterns which are formed in the up and down direction of the core layer. The impedance load includes a through-hole which comprises the transmission line, the second path pattern, and the impedance of the first VIA. The parasitic capacitance load includes the capacitance provided with the second metal plate.
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