| 摘要 |
Light-emitting modules (20a, 20b, 20c, 20d, 20e, 20f) according to the embodiments is configured by mounting a plurality of semiconductor light-emitting elements (36a, 36b, 36c) having the same light-emitting property in a closed-up manner on a substrate (21) and sealing the closed up plurality of semiconductor light-emitting elements by a dome shaped sealing member (45) altogether. |
