POWER MODULE PACKAGE

摘要

PURPOSE: A power module package is provided to improve a heat radiation property by bonding a lead frame to a metal substrate with a ceramic layer of a high insulation property and a high heat radiation property. CONSTITUTION: A substrate(101) includes a ceramic layer(103). A circuit pattern is formed on the ceramic layer. One side of a first lead frame(110) is contacted with the circuit pattern. The other side of the first lead frame outwardly protrudes. A first semiconductor chip(130) is mounted on one side of the first lead frame.