METHOD FOR MANUFACTURING SUBSTRATE WITH METAL POST AND SUBSTRATE MANUFACTURED BY THE SAME METHOD

摘要

PURPOSE: A circuit board manufacturing method and a circuit board manufactured by the same are provided to manufacture the circuit board having a metal post which is formed by etching. CONSTITUTION: A circuit board manufacturing method having a metal post includes following steps. A substrate made of a conducting material is prepared(S100). A first etching of an area corresponding to an insulating unit of a first circuit pattern is selectively performed in a surface of the substrate(S200). A first insulating layer is stacked on a surface of a firstly etched substrate(S300). A second etching is performed to externally expose the metal post and the first circuit pattern on a different surface of the substrate(S500). [Reference numerals] (S100) Step of preparing a substrate made of a conducting material; (S200) Step of firstly etching an area corresponding to an insulating unit of a first circuit pattern on one surface of the substrate; (S210) Step of forming a first photosensitive resist layer; (S220) Step of exposing and developing the first photosensitive resist layer corresponding to the first circuit pattern; (S230) Step of firstly etching the substrate exposed by the first photosensitive resist layer; (S240) Step of removing the first photosensitive resist layer; (S300) Step of laminating a first insulating layer on one surface of the firstly etched substrate; (S350) Step of forming a via passing through the first insulating layer; (S400) Step of forming a second circuit pattern on one surface of the stacked substrate of the first insulating layer; (S500) Step of secondary etching to form a metal post on other surface of the substrate and expose the first circuit pattern to the outside; (S510) Step of exposing and developing a second photosensitive resist layer on other surface of the substrate; (S520) Step of exposing and developing the second photosensitive resist layer corresponding to the metal post; (S530) Step of secondary etching to form the metal post and the first circuit pattern by removing the substrate exposed through the second photosensitive resist layer; (S540) Step of removing the second photosensitive resist layer; (S800) Step of coating PSR one surface of the substrate; (S900) Step of forming solder by plating one part of the metal post