发明名称
摘要 A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.
申请公布号 JP5194513(B2) 申请公布日期 2013.05.08
申请号 JP20070089011 申请日期 2007.03.29
申请人 发明人
分类号 H01L21/3205;B82B1/00;B82B3/00;C23C16/44;H01L21/285;H01L21/768;H01L23/522;H01L23/532 主分类号 H01L21/3205
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