Coating a substrate with a mixing layer or an alloy layer by magnetron sputtering, by depositing two tube magnetrons that are arranged next to each other in a coating chamber, whose outer surfaces comprise a sputterable target material

摘要

The method comprises depositing, in a coating chamber, two tube magnetrons that are arranged next to each other, whose outer surfaces comprise a sputterable target material over which two atomization zones (10) running parallel to its rotational axis are formed by magnetic systems (9) of the tube magnetrons. The atomization zones are formed at the tube magnetrons lying adjacent to each other, where both the tube magnetrons are coated by the atomization zone of other tube magnetrons and a substrate (5) of the atomization zones of both the tube magnetrons. The method comprises depositing, in a coating chamber, two tube magnetrons that are arranged next to each other, whose outer surfaces comprise a sputterable target material over which two atomization zones (10) running parallel to its rotational axis are formed by magnetic systems (9) of the tube magnetrons. The atomization zones are formed at the tube magnetrons lying adjacent to each other, where both the tube magnetrons are coated by the atomization zone of other tube magnetrons and a substrate (5) of the atomization zones of both the tube magnetrons. The tube magnetrons are varied by a parameter such as magnetic system-rotation angle, rotation rate, magnetrons-substrate-distance, tube magnetrons-tube magnetrons-distance, performance, and direction of rotation. A reactive gas zone is formed by a reactive gas supply and is spaced apart form the atomization zones. A conductive transparent layer or a solar energy absorber layer is deposited on the substrate. Independent claims are included for: (1) a chamber for coating substrates with a mixing layer or an alloy layer by magnetron sputtering; and (2) a plant for coating substrates by reactive magnetron sputtering.