| 摘要 |
PURPOSE: A substrate processing apparatus and a substrate processing method are provided to efficiently remove layers on the surface of a substrate by supplying processing gases with different elements according to the materials of the layers on the surface of the substrate. CONSTITUTION: A plasma supplying unit(200) supplies a discharged source gas to a processing chamber(110) and includes a plasma chamber(210), a first source gas supplying unit, and a second source gas supplying unit. The first source gas supplying unit supplies a first source gas to a discharge space. The second source gas supplying unit supplies a second source gas to the discharge space. The second source gas is different from the first source gas.
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