发明名称 THERMOSIPHON COOLER ARRANGEMENT IN MODULES WITH ELECTRIC AND/OR ELECTRONIC COMPONENTS
摘要 <p>PURPOSE: A thermosiphon cooler arrangement in modules having electric and/or electronic components is provided for an improved, efficient, and flexible heat removal from electric and electronic components. CONSTITUTION: A module of an electric and/or electronic system comprises a guiding structure(615) which has an inlet(614) for receiving a stream of cooling air and an outlet(616) for releasing the stream of cooling air; a thermosiphon cooler which includes an evaporator for receiving a first heat load generated by at least one electric and/or electronic component and a condenser for transferring a majority of the first heat load to the cooling air. The evaporator is tilted with respect to the condenser about a tilt axis about a tilting angle.</p>
申请公布号 KR20130047678(A) 申请公布日期 2013.05.08
申请号 KR20120122709 申请日期 2012.10.31
申请人 ABB TECHNOLOGY AG 发明人 COTTET DIDIER;AGOSTINI FRANCESCO;GRADINGER THOMAS;VOEGELI ANDREAS
分类号 H05K7/20;F28D15/02 主分类号 H05K7/20
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