PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PURPOSE: A photosensitive resin composition is provided to form a resist pattern with excellent resolution, density, flexibility, and resist shape. CONSTITUTION: A photosensitive resin composition comprises a binder polymer which has a structure unit derived from (meth)acrylic acids and a structure unit selected from modified dicyclopentenyl(meth)acrylate, modified dicyclopentanyl(meth)acrylate, modified isobornyl(meth)acrylate, modified admantyl(meth)acrylate, and modified cyclohexyl(meth)acrylate; a photopolymerizable compound, and a photopolymerization initiator.