| 摘要 |
PURPOSE: A printed circuit board for forming a solder resist regardless of thickness and a manufacturing method thereof are provided to form a new surface processing layer and the solder resist, thereby having a minute pad. CONSTITUTION: A printed circuit board(100) includes an insulating plate(110), a pad arranged on the insulating plate, a surface processing layer(160) formed on the pad, and a solder resist(140) covering a part of the insulating plate and the surface processing layer.
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