发明名称 Light emitting device package
摘要 A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
申请公布号 US8436385(B2) 申请公布日期 2013.05.07
申请号 US201113114996 申请日期 2011.05.24
申请人 KIM WAN HO;PARK JUN SEOK;LG INNOTEK CO., LTD. 发明人 KIM WAN HO;PARK JUN SEOK
分类号 H01L33/00 主分类号 H01L33/00
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