| 摘要 |
PURPOSE: A laser diode package in which a thermal via is formed is provided to improve the light efficiency of a laser diode and to increase a life span. CONSTITUTION: A stem(210) connects one or more leads delivering an electric signal. A side wall(220) is formed in the edge of the stem perpendicularly. A discharge plate(230) is mounted on the upper surface of the stem and absorbs heat generated in a laser diode chip(250). The photo diode chip forms a photo diode(242) on a photo diode substrate(241), receives laser light generated by the laser diode chip , and determines whether laser light is generated or not. The laser diode chip is formed in the other side of the upper surface of a discharge plate, and includes a substrate, a laser diode, a heat thin film device, and a first thermal via. An optical fiber(260) is arranged in the central axis of laser light generated in the laser diode chip. |
