| 摘要 |
PURPOSE: A semiconductor package is provided to form a bonding support structure between a substrate and a semiconductor chip and to prevent fault. CONSTITUTION: A porous substrate faces a semiconductor chip. A bump electrode structure(230) is arranged between the semiconductor chip and the porous substrate. A bonding support structure(240) bonds the semiconductor chip to the porous substrate. A sealing pattern structure(250) is arranged between the semiconductor chip and the porous substrate. The sealing pattern structure isolates the space between the porous substrate and the semiconductor chip. |
