SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE MODULE HAVING THE SAME

摘要

PURPOSE: A semiconductor package, a method for manufacturing the same, and a semiconductor package module having the same are provided to bond several substrates and a semiconductor chip with one bonding process and to improve process efficiency. CONSTITUTION: A recess(101a) is formed in one surface of a first substrate(101). An opening part(101c) is formed in the bottom of the concave part. A second substrate(103) touches the other surface of the first substrate. A semiconductor chip(107) is mounted in the recess. A bonding part(105) is mounted in the recess through the opening part of the first substrate.