发明名称 |
Repair apparatus and repair method |
摘要 |
A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board. |
申请公布号 |
US8434670(B2) |
申请公布日期 |
2013.05.07 |
申请号 |
US20090485642 |
申请日期 |
2009.06.16 |
申请人 |
OKADA TORU;EMOTO SATOSHI;FUJITSU LIMITED |
发明人 |
OKADA TORU;EMOTO SATOSHI |
分类号 |
B23K3/00;B23K1/00;B23K1/018;B23K3/04 |
主分类号 |
B23K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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