PIEZO-ELECTRIC ELEMENT WAFER PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A piezoelectric element wafer package and a manufacturing method thereof are provided to improve the frequency characteristics using a wafer package formed in a cavity having an upper opening part. CONSTITUTION: A piezoelectric element wafer package includes a wafer package(300), a piezoelectric element(320), and a cap lead(330). A cavity(310) is formed in the wafer package. The piezoelectric element is mounted on the cavity. The cap lead is arranged in the upper part of the wafer package having the piezoelectric element.