发明名称 |
Interchangeable connection arrays for double-sided DIMM placement |
摘要 |
A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed. |
申请公布号 |
US8438515(B2) |
申请公布日期 |
2013.05.07 |
申请号 |
US201113339525 |
申请日期 |
2011.12.29 |
申请人 |
LEDDIGE MICHAEL W.;BAINS KULJIT SINGH;SPRIETSMA JOHN THOMAS;INTEL CORPORATION |
发明人 |
LEDDIGE MICHAEL W.;BAINS KULJIT SINGH;SPRIETSMA JOHN THOMAS |
分类号 |
G06F17/50;G11C5/00;G11C5/02;H05K1/18 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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