发明名称 |
Light emitting diode component |
摘要 |
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board. |
申请公布号 |
US8436380(B2) |
申请公布日期 |
2013.05.07 |
申请号 |
US20100884717 |
申请日期 |
2010.09.17 |
申请人 |
AANEGOLA SRINATH K.;RADKOV EMIL V.;REGINELLI JAMES;STADELMAN LARRY R.;MRAKOVICH MATTHEW;STIMAC TOMISLAV J.;GE LIGHTING SOLUTIONS, LLC |
发明人 |
AANEGOLA SRINATH K.;RADKOV EMIL V.;REGINELLI JAMES;STADELMAN LARRY R.;MRAKOVICH MATTHEW;STIMAC TOMISLAV J. |
分类号 |
F21K99/00;H01L29/22;H01L27/15;H01L29/227;H01L29/24;H01L29/267 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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