CIRCUIT COMPONENT AND PROCESS FOR PRODUCING THE SAME

摘要

PURPOSE: A circuit component and a manufacturing method thereof are provided to well connect a substrate with an IC chip. CONSTITUTION: A circuit component(1) is formed by connecting an IC chip(4) to a substrate through a conductive adhesive(5) containing conductive particles. A mount surface of the IC chip installs a bump electrode and a non-electrode surface excluding the part which the bump electrode is formed. Each of the conductive particles is arranged in a first stage in between the surface of the substrate and the non-electrode surface while facing the surface of the substrate and the non-electrode surface. The each of the conductive particles is arranged in a second state flatter than the first stage in between the surface of the substrate and the bump electrode to be submerged in the bump electrode.