| 摘要 |
PURPOSE: A sputtering device is provided to prevent a part of a sputtering target from being eroded and overlapped and to effectively use the sputtering target. CONSTITUTION: A back plate(105) supports a sputtering target(104). The sputtering target is placed in a high vacuum chamber to perform a sputtering process. A magnet(108) faces the sputtering target. A shielding layer is formed between a cavity plate(101) and the back plate to shield magnetic fields. A moving unit(109) reciprocates between the magnet and the sputtering target.
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