WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A wiring substrate and a manufacturing method thereof are provided to improve reliability, by comprising a protrusion electrode appropriate for connection with a component. CONSTITUTION: A laminated part comprises a main surface and a back surface, and is formed by stacking a plurality of interlayer insulation films and a plurality of conductive films. A plurality of protrusion electrodes(11) are arranged in an electrode forming area(133) of the main surface. A via conductor(149) connects the protrusion electrode and the conductive film on the uppermost interlayer insulation film having the main surface. The wiring substrate arranges the plurality of protrusion electrodes in an electrode forming area on the main surface. At least one of the plurality of protrusion electrodes sets an external diameter(A) larger than an external diameter(A2) of the via conductor.