发明名称 ETCHING SOLUTION COMPOSITION FOR METALFILM COMPRISING COPPER LAYER AND/OR COPPER ALLOY LAYER, AND ETCHING METHOD USING SAME
摘要 PURPOSE: An etchant composition for a metal layer including a copper layer and/or a copper alloy layer and an etching method thereof are provided to etch a metal film and a laminated film to a high precision. CONSTITUTION: An etchant composition for a metal layer including a copper layer and/or a copper alloy layer and an etching method thereof includes cu(II) ion,β-alanine, and water. [Reference numerals] (AA) Cu/CuMn substrate J.E.T.(s); (BB) Copper ion concentration(mol/l)
申请公布号 KR20130045190(A) 申请公布日期 2013.05.03
申请号 KR20120117706 申请日期 2012.10.23
申请人 KANTO KAGAKU KABUSHIKI KAISHA 发明人 KUROIWA KENJI
分类号 C23F1/18;C23F1/44 主分类号 C23F1/18
代理机构 代理人
主权项
地址