PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to completely remove dimples by forming a second plating layer after selectively polishing a first plating layer. CONSTITUTION: A via hole is formed in an insulation layer(120). A first plating layer(140) is formed on the insulation layer. An upper plane of the first plating layer is polished. A mask layer(150) is selectively formed on the first plating layer. A second plating layer(160) is formed on the first plating layer.