SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A substrate and a semiconductor package using the same are provided to prevent the generation of a chip crack due to step coverage by filling a ball land which is exposed from the open region of an SR layer with a solder layer. CONSTITUTION: A solder ball is electrically connected to a circuit line of a wiring substrate(11) through a ball land(21) which is exposed from an SR layer(A). The ball land includes a solder layer(700) which is made of the same material as a ball land. A step coverage(100) between the ball land and the SR layer is removed by filling a ball land part which is exposed from the open area of the SR layer. The mold process temperature of the wiring substrate is in a range of 170-190 deg. C. The melting point of the solder layer is 200 deg. C or greater.