发明名称 METALLIC MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a metallic material for electronic components, which has low insertion and removal resistance, low whisker generation property and high durability, and a method for producing the same. <P>SOLUTION: The metallic material 10 for electronic components is provided with: a base 11; a layer A 14 that constitutes the outermost layer of the base 11 and is formed of Sn, In or an alloy of these elements; and a layer B 13 that is arranged between the base 11 and the layer A 14 so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A) 14 has a thickness of 0.002-0.2 &mu;m, and the intermediate layer (the layer B) 13 has a thickness of 0.001-0.3 &mu;m. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013079439(A) 申请公布日期 2013.05.02
申请号 JP20120033265 申请日期 2012.02.17
申请人 JX NIPPON MINING & METALS CORP 发明人 SHIBUYA YOSHITAKA;FUKAMACHI KAZUHIKO;KODAMA ATSUSHI
分类号 C23C30/00;B32B15/04;C22C5/02;C22C5/04;C22C5/06;C22C5/08;C22C5/10;C22C9/00;C22C9/02;C22C9/04;C22C9/05;C22C9/06;C22C13/00;C22C13/02;C22C19/00;C22C22/00;C22C27/06;C22C28/00;C22C30/06;C22C38/00;C25D5/10;C25D7/00 主分类号 C23C30/00
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