| 摘要 |
<p>[Problem] To provide a highly reliable circuit board, which can be used for a long period of time, and an electronic apparatus configured by having an electronic component mounted on the circuit board, by making a metal wiring layer have excellent heat dissipating characteristics that make it possible to rapidly dissipate heat generated due to operations of the electronic component, and by reducing metal wiring layer peeling due to cooling/heating cycle by improving adhesion strength between a ceramic sintered body and the metal wiring layer, said cooling/heating cycle being generated when repeating operation and non-operation of the electronic component. [Solution] This circuit board is configured by having a metal wiring layer (12) provided at least on one main surface of a ceramic sintered body (11). The metal wiring layer has: a first region (12a), which is in contact with the main surface, and contains a glass component; and a second region (12b), which is positioned on a first region (12a), and does not contain the glass component. A thickness of the first region (12a) is 35-70 % of that of the metal wiring layer (12). An average grain diameter in the first region (12a) is smaller than that in the second region (12b).</p> |
