| 摘要 |
<p>A polyamide resin according to the present invention uses a dicarboxylic acid component and a diamine component, wherein the dicarboxylic acid component includes an oxalate compound, the diamine component includes a diamine (a) and a diamine (b), the diamine (a) is at least one type of diamine selected from the group consisting of diamines having 2 to 8 carbon atoms, the diamine (b) is at least one type of diamine selected from the group consisting of diamines having 10 to 18 carbon atoms, and the molar ratio of the diamine (a) and the diamine (b) is 1:99 to 99:1. Thus, the polyamide resin has excellent chemical resistance and little oxidative heat.</p> |
