发明名称 Heat Removal From Substrates In Vacuum
摘要 Systems and methods to precisely balance the amount of heat removed from a specimen with the amount of heat generated during processing are presented. In some embodiments, the heat introduced into the specimen is rapidly removed by a temperature controlled cooling element via radiative heat transfer. In some embodiments, a heating element is disposed between the specimen and the cooling element. The heating element is controlled to precisely balance the amount of heat removed from the specimen with the amount of heat generated. A control signal is generated based on the amount of process energy known apriori. The control signal may also be based on an indication of a temperature of the specimen. In some embodiments, an adjustable aperture is employed to change the surface area of the cooling element exposed to the specimen, and thus control the amount of heat absorbed from the specimen by the cooling element.
申请公布号 US2013105108(A1) 申请公布日期 2013.05.02
申请号 US201213661146 申请日期 2012.10.26
申请人 KLA-TENCOR CORPORATION;KLA-TENCOR CORPORATION 发明人 ZYWNO MAREK;HALE LAYTON CARTER
分类号 G05D23/19;F25B29/00 主分类号 G05D23/19
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