发明名称 |
MULTI-FLUID, TWO-PHASE IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) |
摘要 |
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture. The cooling structure facilitates heat removal from the fluid-tight compartment.
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申请公布号 |
US2013105120(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201113281945 |
申请日期 |
2011.10.26 |
申请人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E. |
分类号 |
F28D15/02 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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