| 摘要 |
For the secure keeping of wafers 8 and for prevention of penetration and/or migration by an active ingredient present in the wafer 8 into the packaging material of a primary pack which serves to keep the wafer 8, and, furthermore, for the easy removal of the wafer 8 after the opening of the primary pack, a wafer sachet 1 as the primary pack is proposed, being formed by a layer construction of films, which comprises first and second sealing films 3, 4 which are connected to one another via at least one sealing region, so that between the first and second sealing films 3, 4 a cavity 7 is formed which is closed off to the outside and is suitable for receiving the wafer 8. In accordance with the invention, the layer construction further comprises at least one peeling film 2 which is connected to the first sealing film 3, which is intended for opening the wafer sachet 1, which is partly removable from the first sealing film 3 on opening of the wafer sachet 1, and which, when it is partly removed from the first sealing film 3, causes incisive tearing of the first sealing film 3 on further opening of the wafer sachet 1, so that the cavity 7 is opened to the outside.
|
