| 摘要 |
Embodiments of the present application provide an insulating ring for packaging, an insulating ring assembly and a package. A through hole of the insulating ring drills through a top surface and a bottom surface of the insulating ring to accommodate a chip. An outer sidewall of the insulating ring has an outward extending protrusion. A side surface of the protrusion which faces the top surface is lower than the top surface. A pin is disposed on the side surface, and an adhesive material layer and a surface metallization layer in the pin are lower than the top surface. Therefore, silver ions in the adhesive material cannot pass around the outer sidewall and the top surface above the side surface to enter the package, thereby ensuring the reliability of a power amplifier (PA) device.
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