发明名称 |
HIGH METAL IONIZATION SPUTTER GUN |
摘要 |
<p>In one aspect of the invention, a process chamber is provided. The chamber includes a plurality of sputter guns with a target affixed to one end of each of the sputter guns. Each of the plurality of sputter guns is coupled to a first power source. The first power source is operable to provide a pulsed power supply to each of the plurality of sputter guns. The pulsed power supply has a duty cycle that is less than 30%. A substrate support disposed at a distance from the plurality of sputter guns is included. The substrate support is coupled to a second power source. The second power source is operable to bias a substrate disposed on the substrate support, wherein the duty cycle of the second power source is synchronized with a duty cycle of the first power source. A method of performing a deposition process is also included.</p> |
申请公布号 |
WO2013063616(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
WO2012US63072 |
申请日期 |
2012.11.01 |
申请人 |
INTERMOLECULAR, INC. |
发明人 |
YANG, HONG SHENG;CHIANG, TONY P.;CHILD, KENT RILEY;LANG, CHI-I;SHAO, SHOUQIAN |
分类号 |
C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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