| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist film formation apparatus and a resist film formation method which volatilize a proper amount of a solvent from a resist layer, thereby realizing an accurate resist pattern after exposure. <P>SOLUTION: A resist 4 is dropped on a substrate which is being rotated to be extended through the rotation, and a sample where the resist 4 is applied onto the substrate 2 is heated. At that time, a weight of the heated sample is measured by a measuring part 42. Then, a process where heating is continued until a constant amount of a solvent is volatilized from the resist 4 applied to the sample on the basis of the measured weight of the sample and a resist layer Rn is deposited on the substrate 2, is performed. Further, a process where a resist layer is deposited on the resist layer Rn deposited on the sample, is repeatedly performed predetermined times, and multiple resist layers are laminated on the sample. <P>COPYRIGHT: (C)2013,JPO&INPIT |
