发明名称 MANUFACTURING METHOD OF LIQUID INJECTION HEAD, MANUFACTURING METHOD OF LIQUID INJECTION DEVICE, AND MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid injection head with a piezoelectric element having a small environmental load and a large strain amount, a manufacturing method of a liquid injection device, and a manufacturing method of the piezoelectric element. <P>SOLUTION: A manufacturing method of a liquid injection head comprises the steps of: forming a substrate 110, an elastic film 50, an adhesion layer 56, and an electrode 60; forming a coating film above the electrode 60 by applying a precursor solution containing bismuth, iron, barium, and titanium; drying the coating film at an actual temperature of 165&deg;C or higher and 185&deg;C or lower by heating; degreasing the coating film at an actual temperature of 330&deg;C or higher and 440&deg;C or lower by heating after the drying step; and forming a piezoelectric film 72 by crystallizing the degreased coating film by heating after the degreasing step. This forms a piezoelectric layer 70 of a prescribed thickness. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013080882(A) 申请公布日期 2013.05.02
申请号 JP20110221359 申请日期 2011.10.05
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI TOSHIAKI
分类号 H01L41/39;B41J2/045;B41J2/055;H01L21/316;H01L21/8246;H01L27/105;H01L41/08;H01L41/09;H01L41/107;H01L41/18;H01L41/22 主分类号 H01L41/39
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