| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting module composed of a lens component, which has a function for allowing the lens part to be aligned and fixed to be mounted without using YAG welding and is manufactured at low cost, and to provide a carrier component including a mounting structure of the lens part. <P>SOLUTION: A light emitting module is formed by housing a carrier 13, where a semiconductor laser 14 mounted on a sub-mount and a lens component 16 condensing light emitted from the semiconductor laser are mounted, in a package. The lens component 16 has a metalization process part 19, and the metalization process part is fixed to a mounting surface of the carrier 13 through soldering 17. The metalization process part of the lens component is formed at least one of three surfaces, which are a surface, facing the mounting surface of the carrier, and ranges of a front surface and a rear surface which do not reach a lens part arranged perpendicular to and connecting with the surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
