| 摘要 |
An illumination device includes a point light source disposed on a base substrate, a package in which the point light source is sealed with a wavelength converter for converting a wavelength of light from the point light source, an optical member for controlling light from the package, a housing with an attachment face for holding the optical member and a bonding part for holding the package, and a circuit board on which the package is mounted. A space is provided between the wavelength converter and the optical member. The bonding part of the housing is directly positioned and fixed to a reference face of the package. This makes the heat generated from the LED chip released via the housing. Accordingly, a heat quantity transferred to the lens can be reduced.
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