发明名称 |
WICKING VAPOR-CONDENSER FACILITATING IMMERSION-COOLING OF ELECTRONIC COMPONENT(S) |
摘要 |
Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment. The wicking component(s) facilitates drawing condensed fluid from a surface of the thermally conductive condenser fin(s) and thereby enhances heat transfer across the surface of the condenser fin(s).
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申请公布号 |
US2013105122(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201113281669 |
申请日期 |
2011.10.26 |
申请人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E. |
分类号 |
F28D15/04 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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地址 |
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