发明名称 |
LEAD FRAME SEMICONDUCTOR DEVICE |
摘要 |
A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.
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申请公布号 |
US2013105957(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213659557 |
申请日期 |
2012.10.24 |
申请人 |
WATANABE SHINJI;EIMORI AKIHISA;SONY CORPORATION |
发明人 |
WATANABE SHINJI;EIMORI AKIHISA |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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