COMPOSITION FOR POLISHING PURPOSES, POLISHING METHOD USING SAME, AND METHOD FOR PRODUCING SUBSTRATE

摘要

Provided is a composition for polishing purposes, which comprises abrasive grains, a water-soluble polymer, an aggregation inhibitor and water, said composition being characterized in that the R1/R2 ratio is 1.3 or less wherein R1 represents the average particle diameter of particles present in the composition for polishing purposes and R2 represents the average particle diameter of the abrasive grains when the abrasive grains are dispersed in water at the same concentration as that of the abrasive grains in the composition for polishing purposes. The composition for polishing purposes can be used mainly for polishing the surface of a silicon substrate.