Lab-on-chip for e.g. analytic applications, has structure and film layers that are formed in bonding regions and below recess portions, and non-bonding areas that are provided under metallic portions provided in structured metal films

摘要

The lab-on-chip (10) has a structure layer (22) having a micro-fluidic structure. The film layer (23) and structured metal films (12,25) are formed on the structure layer. The metallic portions (13,14,25a,25b) and recess portions (25c,25d) are provided in the structured metal films. The structure layers and film layers are formed in the bonding regions (FB) and below the recess portions. The non-bonding areas (NFB) are provided under the metallic portions. The film layer is made of thermoplastic elastomer and the structure layer is made of polycarbonate. An independent claim is included for manufacturing method of lab-on-chip.