Method for feeding saw wire in multi wire saw used for cutting silicon wafer, involves rotating secondary peripheral region of saw wire into abrasive zone when saw wire is partially rotated about longitudinal axis

摘要

The method involves engaging portion of saw wire (D) between wire guide rollers (R1,R2) within the wire field (DF). The material to be separated is engaged with primary peripheral region in abrasive zone. The primary peripheral region is rotated from the abrasive zone and secondary peripheral region of saw wire is rotated into abrasive zone when the saw wire is partially rotated about longitudinal axis. An independent claim is included for device for feeding saw wire.