LARGE PANEL LEADFRAME

摘要

A method of manufacturing an integrated circuit package includes mounting a large panel leadframe having a substantially square shape to a ring. The large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. An integrated circuit chip is attached to each of the die pads. An encapsulant material is applied over the integrated circuit chips and at least a part of the large panel leadframe. Each of the die pads and its corresponding leads are separated from the large panel leadframe to form individual integrated circuit packages. The steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to a taped ring.