| 摘要 |
A heat sink device includes a heat sink module which comprises a plurality of heat sink fins and at least one heat conduction pipe. The heat sink fin has an extension portion integrally formed with a lower end of the heat sink fin. The extension portion is folded to form a semi-finished compressed block. The semi-finished compressed block has a bottom formed with at least one engaging recess by stamping to constitute a compressed block. The heat sink fins are connected one by one and the compressed blocks of the heat sink fins are connected with each other to form a block member as a base. The engaging recesses of the heat sink fins form an engaging passage for engagement of the heat conduction pipe to constitute the heat sink device having the heat conduction pipe.
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