| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition which does not impair resin properties and has excellent low-dielectric properties even when a polytetrafluoroethylene filler is blended therewith. <P>SOLUTION: The resin composition contains: an epoxy resin represented by formula (I); a phenol resin represented by specific formula, as a curing agent; and a polytetrafluoroethylene filler, wherein, in formula, n represents an integer of 0-50, and A represents at least one bivalent group selected from a group of specific formulae. <P>COPYRIGHT: (C)2013,JPO&INPIT |
