| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package and semiconductor disk device using the same, capable of improving reliability after packaging. <P>SOLUTION: The semiconductor package and semiconductor disk device using the same includes a package substrate 11 that is packaged with a semiconductor chip 12 on a first major surface; a plurality of detection bumps 161a-164c that is formed on a second major surface of the package substrate 11 and is not electrically connected to the semiconductor chip 12; and detection wirings 17a-17f that are provided on the package substrate 11 and are used for electrically connecting at least two of the detection bumps 161a-164c. <P>COPYRIGHT: (C)2013,JPO&INPIT |
