| 摘要 |
An imaging device includes: an imaging sensor 110; a main circuit substrate 120 includes a first ground conductor; an imaging sensor cable 130 that includes a second ground conductor, has the imaging sensor 110 mounted thereon, and is connected to the main circuit substrate 120; a metal plate 150 that is disposed between the main circuit substrate 120 and an area of the imaging sensor cable 130 where the imaging sensor 110 is mounted thereon, and that is electrically connected to the second ground conductor; and a ground connection conductor 190 that electrically connects between the first ground conductor and the metal plate 150. The ground connection conductor 190 is disposed in an area where the imaging sensor 110 and the imaging sensor cable 130 overlap each other or in an area where the imaging sensor 110 and the main circuit substrate 120 overlap each other. |
