发明名称 |
LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME |
摘要 |
Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body. |
申请公布号 |
WO2013062289(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
WO2012KR08726 |
申请日期 |
2012.10.23 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
KIM, BYOUNG SUNG;LIM, SANG EUN;LEE, JAE JIN;SON, YEOUN CHUL |
分类号 |
H01L33/48;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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